Tempyrox Cleaning Systems
Technology

Ordinary cleaning methods of laboratory glassware and metals parts can be difficult and costly, but a new high-temperature cleaning process developed by Tempyrox eliminates the hazards and reduces the costs often associated with removing organic matter off laboratory glassware & metals parts.

Pyro-Clean

The technique, called pyrolysis-oxidation, uses a special high temperature oven designed to carry out an automated two stage cleaning process.

During the first pyrolysis - stage, the oven chamber self inerts purging the cleaning chamber of oxygen while the cleaning chamber temperature is raised to about 900° F. During this stage organic contaminants are pyrolyzed, leaving only carbonized residue on the glassware or parts.

In the second oxidation - stage, the carbonized residue is quickly removed by the introduction of air into the 900° F cleaning chamber. At this temperature, the carbon residues are oxidized rapidly. After a preset time, the oven heaters shut off and begin to cool to room temperature, at which time the glassware or part can be unloaded.

The pyrolysis-oxidation method has several advantages over traditional solvent or chemical cleaning methods:

·The Process is completely automated and essentially labor free. The oven can be loaded with all types, sizes and shapes of glassware or metal parts. Once started, the oven can be left unattended as the contaminants are removed. Only a final rinsing with water may be necessary to remove any residuals of inorganic ash.

·A wide range of contaminants can be removed. Virtually any residue, organic in nature, can be pyrolyzed - including plastics, resins, waxes, asphalts, and tars.

·All solvents or chemical cleaning agents are eliminated.

·Because the process is completely automated this increases safety, reduces handling, and reduces solvent costs. Breakage is naturally reduced due to the minimal amount of handling required. Glassware and parts previously thought of as unsalvageable, are easily cleaned - reducing replacement costs.